General Information
 
International Advisory Committee

Co-Chairs
Kwai-Man Luk, City University of Hong Kong, China
Yueping Zhang, Nanyang Technological University, Singapore
Wenyan Yin, Zhejiang University, China

Members
Arokiaswami Alphones, Nanyang Technological University, Singapore
Abd A. Arkadan, Colorado School of Mines, USA
Sami Barmada, University of Pisa, Italy
Chi-Hou Chan, City University of Hong Kong, Hong Kong
Tang-Sheng Chen
, Science and Technology on Monolithic Integrated Circuits and Modules Laboratory, Nanjing Electronic Devices Institute, China
H.C. Chiu, Chang Gung University, Taiwan
Tiejun Cui, Southeast University, China
Khaled ElMahgoub, Autoliv, Inc., USA
Yong Fan , University of Electronic Science and Technology, China
Dagang Fang, Nanjing University of Science and Technology, China
Steven Gao , University of Kent, UK
Randy Haupt, Colorado School of Mines, USA
Erping Li , Zhejiang University, China
Haiwen Liu , East China Jiaotong University, China
Qinghuo Liu , Duke University, USA
Xueguan Liu , Soochow University, China
Osama Mohammed
, Florida International University, USA
Branislav Notaros , Colorado State University, USA
Chul Soon Park , Korea Advanced Institute of Science and Technology, Korea
Andrew F Peterson , Georgia Institute of Technology, USA
C.J. Reddy , Altair, USA
Atif Shamim , King Abdullah University of Science and Technology, Saudi Arabia
Hui Tan , State Key Laboratory of EMC, China
John Volakis, Ohio State University, USA
Lei Zhu, University of Macau, Macau

 

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