General Information
Home
Organizing Committee
International Advisory Committee
Technical Program Committee
Important Dates
 
 
LATEST ANNOUNCEMENTS
Click HERE to download Final Technical Program.
Online Registration is now OPENED.
Click HERE to download Registration Form in PDF format.
Presentation Instructions is ONLINE.

IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP 2021) is co-organized by National University of Singapore Chongqing Research Institute, Chongqing University, NUS Suzhou Research Institute, Northwestern Polytechnical University, Science and Technology on Monolithic Integrated Circuits and Modules Laboratory, and IEEE AP/MTT Joint Societies Chongqing Chapter. IMWS-AMP 2021 is a continuation of a series of annual international events held in Suzhou, China (2015), Chengdu, China (2016), Pavia, Italy (2017), Michigan, USA (2018), Bochum, Germany (2019) and Virtual (2020). The purpose of this platform is to boost technical and educational activities as well as exchanges and collaborations within the international microwave community.

IMWS-AMP 2021 will be held in Chongqing, China on Nov 15-17, 2021. IMWS-AMP 2021 will feature both invited and contributed papers. Distinguished researchers will be invited to deliver keynote speeches on technology trends and significant advances in relevant topics. Contributed papers are solicited for the same topics as listed below.

Topics:
The topics include, but are not limited to, the following technical areas:

• Carbon nanotubes and 2D electronic and optoelectronic devices (e.g. graphene and beyond graphene)
• Wide bandgap and other emerging semiconductor materials (e.g. ionic materials) based electronic devices: characterization, modelling and design
• Advanced silicon, integrated passive devices and through substrate via
• Low-temperature co-fired ceramic and liquid crystal polymer based microwave devices
• Large-area printing, inkjet printing and 3D printing materials and processes for RF and THz applications
• Fan-out wafer/panel level packaging for 5G mmWave and IoT, etc.
• Flexible materials for RF electronics and antennas
• Engineered metamaterials and plasmonics for absorption, cloaking, and wave manipulation
• Ferromagnetic materials and superconducting materials
• Spin-wave and magnetic crystal materials
• Passive/active microwave and terahertz devices (material characterization, fabrications, and applications)
• Antennas with advanced/complex/artificial materials and processes

 

Important Dates:

Paper Submission Deadline: July 15, 2021, Aug 15, 2021

Notification of Acceptance: Aug 31, 2021, Sept 15, 2021

Final paper Submission: Sept 15, 2021, 30 Sept, 2021

 

Conference Venue:

Chongqing, China

 

For Any Enquiries, Please Contact Us: imws2021@nusri.cn

____________________________________________________________________________________________________________________________
Organizers

____________________________________________________________________________________________________________________________
Technical Co-Sponsors

____________________________________________________________________________________________________________________________
   

Exhibition and Sponsors
Exhibition of company products is solicited for the areas related to the topics. Interested parties should contact the Conference Secretariat.